1. Please upload the Gerber & BOM Files and board making instructions
2. The uploaded file format supports ZIP, RAR, 7Z compression package, less than 50MB
1. Please upload the Gerber Files and board making instructions
1. Please upload the BOM Files
Discover bqpwb’s RF antenna PCB, engineered for superior performance in radio frequency applications. Our PCBs are designed to enhance signal quality and reliability, offering optimal solutions for RF and antenna technologies.
Semiconductor Field Test Probe Card 36 layers 2+N+2 Board Thickness: 4.8 mm Minimum Hole Size: 0.2 mm Hole-to-Line Distance: 0.14 mm
Product Details
Semiconductor Field Test 16 layers 7-step HDI 7+N+7 HDI Thickness: 2.4 mm Minimum hole size: 0.15 mm Hole-to-line distance: 0.07 mm Minimum line width/distance: 0.055/0.055 mm Surface Finish: ENIG
Application Characteristic Material Layer Communication High speed+high TG material IT968TC+Shengyi S1000-2M 10L Thickness Min hole diameter Min width/space Internal Number 1.00.1mm Laser hole: 0.10mm, Mechanical hole 0.15mm 100/100um S221021G10 Surface f
Step golden finger board Material: TU-872SLK 22 layers 1-step HDI 1+N+1 HDI Thickness: 3.0 mm Minimum hole size: 0.25 mm Hole-to-line distance: 0.13 mm Surface Finish: ENIG + Gold finger + Back drill
Application: Computer Product Features: 2x Laser drilling, 3x Pressfit, 2-step HDI board Material: Shengyi S1000-2M Layers: 10L Board Thickness: 1.60.16mm Minimum Hole Size: Laser hole: 0.127mm; Mechanical hole: 0.20mm, Aspect ratio: 8:1 Minimum Line Widt
Semiconductor Field Interposer 14 layers 4-step HDI 4+N+4 HDI Thickness: 2.6 mm Minimum hole size: 0.1 mm Hole-to-line distance: 0.1 mm Minimum line width/spacing: 0.06/0.09 mm
Fixture Test Board 4 layers Surface Finish: ENIG Minimum Line Width/Spacing: 0.05/0.05 mm Impedance Tolerance: +/-8%
High Speed Chip Server Card Material: TU-872SLK + RO4350 16 layers Board Thickness: 1.6 mm Minimum Line Width/Spacing: 0.075/0.075 mm Surface Finish: ENIG + Gold finger
100G Optical Communication Module Material: R-5775G 10 layers 2-step HDI 2+N+2 HDI Surface Finish: Nickel plated palladium
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